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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9611358 B1

PDFFull Text
Date of Patent:
Apr. 04, 2017

Filed:

Apr. 08, 2014

Laminate, and element comprising substrate manufactured using same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hye Won Jeong, Daejeon, KR;

Kyungjun Kim, Daejeon, KR;

Kyoung Hoon Kim, Daejeon, KR;

Chan Hyo Park, Daejeon, KR;

BoRa Shin, Daejeon, KR;

Seung Yup Lee, Daejeon, KR;

HangAh Park, Daejeon, KR;

JinHo Lee, Daejeon, KR;

MiRa Im, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

John P Dulka

Assistant Examiner:

Charles R Peters

Int. Cl.
CPC ...
C08G 73/10 (2006.01); B32B 37/26 (2006.01); B32B 43/00 (2006.01); B32B 7/06 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1067 (2013.01); B32B 7/06 (2013.01); B32B 37/26 (2013.01); B32B 43/006 (2013.01); H01L 31/02 (2013.01); H01L 31/18 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/52 (2013.01); H01L 51/56 (2013.01); B32B 2037/268 (2013.01); B32B 2379/08 (2013.01); H01L 2251/5338 (2013.01); Y10T 156/1195 (2015.01); Y10T 428/31623 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31721 (2015.04);
Abstract

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

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