The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Dec. 03, 2014
Invensense, Inc., San Jose, CA (US);
Peter Smeys, San Jose, CA (US);
Mozafar Maghsoudnia, San Jose, CA (US);
INVENSENSE, INC., San Jose, CA (US);
Abstract
A method and system for providing a MEMS sensor integrated with a flip chip are disclosed. In a first aspect, the system comprises a MEMS sensor, at least one flip chip coupled to the MEMS sensor, and at least one through-silicon via (TSV) that electrically connects the at least one flip chip to the MEMS sensor. In a second aspect, the system comprises a MEMS sensor that includes a CMOS coupled to a MEMS structure, wherein the CMOS comprises a substrate coupled to an interconnect in contact with the MEMS structure. The system further comprises a plurality of flip chips coupled to the substrate, a plurality of TSV that electrically connect the plurality of flip chips to the interconnect, and a plurality of layers on the substrate to provide electrical connections between the plurality of flip chips and from the plurality of flip chips to at least one external component.