The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Jun. 15, 2012
Applicants:

Tomomi Yukumoto, Tokyo, JP;

Takeshi Yamasaki, Tokyo, JP;

Shoji Akiyama, Tokyo, JP;

Yuji Akiyama, Tokyo, JP;

Inventors:

Tomomi Yukumoto, Tokyo, JP;

Takeshi Yamasaki, Tokyo, JP;

Shoji Akiyama, Tokyo, JP;

Yuji Akiyama, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 3/20 (2006.01); B32B 3/30 (2006.01); B32B 27/08 (2006.01); B32B 3/08 (2006.01); B01L 3/00 (2006.01); G01N 21/51 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B32B 3/08 (2013.01); B32B 3/266 (2013.01); B32B 27/08 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0654 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0838 (2013.01); B01L 2300/0877 (2013.01); B01L 2300/0887 (2013.01); B32B 2307/412 (2013.01); G01N 2021/513 (2013.01); Y10T 428/24612 (2015.01);
Abstract

There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.


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