The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Mar. 12, 2012
Applicants:

Jeff Upton, Carlsbad, CA (US);

Haydn Forward, Ramona, CA (US);

Frank Ames, Jr., San Diego, CA (US);

Inventors:

Jeff Upton, Carlsbad, CA (US);

Haydn Forward, Ramona, CA (US);

Frank Ames, Jr., San Diego, CA (US);

Assignee:

Specialty Manufacturing Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 51/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/00 (2013.01);
Abstract

A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.


Find Patent Forward Citations

Loading…