The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Sep. 12, 2014
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Koki Iwasawa, Akiruno, JP;
Assignee:
Olympus Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/27 (2006.01); B29C 45/00 (2006.01); B29C 45/20 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/278 (2013.01); B29C 45/0046 (2013.01); B29C 45/20 (2013.01); B29C 45/27 (2013.01); B29C 2045/0086 (2013.01); B29C 2045/2779 (2013.01); B29L 2011/0016 (2013.01);
Abstract
A hot-runner molding apparatus includes a hot-runner nozzle, a hot-runner molding die and a runner unit. The positions of outflow hole portions are arranged rotationally-symmetrical with respect to the positions of the runner groove portions in such a manner that the molten resin is equally distributed from a gate hole portion to the runner groove portions.
Iwasawa, Koki. (2017). Hot-runner molding apparatus and hot-runner nozzle (U.S. Patent No. 9610722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9610722
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile