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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9610717 B1

PDFFull Text
Date of Patent:
Apr. 04, 2017

Filed:

Oct. 14, 2014

Composite of resin and other materials and method for manufacturing the same

Applicants:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Shyan-Juh Liu, New Taipei, TW;

Kar-Wai Hon, New Taipei, TW;

Sha-Sha Liu, Shenzhen, CN;

Assignees:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;

Attorney:

Steven M. Reiss

Primary Examiner:

Lan Vinh

Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 45/14 (2006.01); B32B 3/30 (2006.01); B32B 7/08 (2006.01); B32B 7/04 (2006.01); B29C 59/14 (2006.01); B29C 37/00 (2006.01); G03F 7/00 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29C 37/0082 (2013.01); B29C 59/14 (2013.01); B32B 3/30 (2013.01); B32B 7/045 (2013.01); B32B 7/08 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); G03F 7/0002 (2013.01); B29C 2045/14868 (2013.01); B29C 2045/14885 (2013.01); B29K 2101/12 (2013.01); B32B 2250/02 (2013.01); B32B 2262/101 (2013.01); B32B 2398/20 (2013.01); B32B 2509/00 (2013.01); B32B 2605/08 (2013.01); Y10T 428/24521 (2015.01);
Abstract

A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.

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