The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
May. 07, 2014
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Deok Ki Hwang, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 1/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/24 (2006.01); B23K 1/00 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); B22F 1/00 (2006.01); B23K 35/00 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B22F 1/0003 (2013.01); B22F 1/025 (2013.01); B23K 1/0016 (2013.01); B23K 35/0244 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/36 (2013.01); B23K 35/3612 (2013.01); H01L 24/14 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H05K 3/3463 (2013.01); B22F 2998/10 (2013.01); C22C 1/0425 (2013.01); C22C 1/0483 (2013.01); H01L 24/32 (2013.01); H01L 2224/27442 (2013.01); H01L 2224/27849 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/01322 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0272 (2013.01);
Abstract
A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).