The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Aug. 08, 2013
Applicant:

Yamaha Hatsudoki Kabushiki Kaisha, Shizuoka-ken, JP;

Inventors:

Yoshitaka Narita, Shizuoka, JP;

Takeshi Fujimoto, Shizuoka, JP;

Hidetoshi Sato, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05K 13/04 (2006.01); B41F 15/08 (2006.01); B41F 15/42 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); B41F 15/0881 (2013.01); B41F 15/42 (2013.01); B41F 15/423 (2013.01); B41P 2215/50 (2013.01); H05K 3/1233 (2013.01); H05K 3/3484 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/532 (2015.01);
Abstract

Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.


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