The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Feb. 03, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Raymond F. Babcock, Stewartville, MN (US);

Matthew A. Butterbaugh, Rochester, MN (US);

Eric A. Eckberg, Rochester, MN (US);

Gerhard I. Meijer, Zurich, CH;

David R. Motschman, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); H05K 1/0204 (2013.01); H05K 7/20409 (2013.01);
Abstract

A system includes an integrated circuit and a heatsink mounted thereon. The heatsink includes a flat base plate thermally coupled to a top surface of the integrated circuit, thermally-conductive solid metal posts mounted perpendicularly on the base plate, and flat metal fins. Each of the fins has holes fitted about the posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the top surface of the base plate. The system further includes a load plate mounted upon top surfaces of the posts, a printed circuit board, and a microprocessor socket mounted on the printed circuit board. The microprocessor socket includes a socket base upon which the integrated circuit is mounted such that the integrated circuit is electrically coupled through the socket base to the printed circuit board. Air may be forced through the heatsink.


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