The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Oct. 25, 2013
Applicant:
Nsk Ltd., Shinagawa-ku, Tokyo, JP;
Inventors:
Assignee:
NSK Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/02 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 24/35 (2013.01); H01L 24/37 (2013.01); H01L 24/41 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 23/142 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/352 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/3701 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37139 (2013.01); H01L 2224/37144 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40475 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/4112 (2013.01); H01L 2224/48 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/77272 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84424 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/85 (2013.01); H01L 2224/9221 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/351 (2013.01);
Abstract
To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module () includes substrate () made of metal, an insulating layer () formed on the substrate (), a plurality of wiring patterns (to) formed on the insulating layer (), a bare-chip transistor () mounted on a wiring pattern () via a solder (); and a metal plate connector () jointing an electrode (S, G) of the bare-chip transistor () and a wiring pattern () via a solder (). The metal plate connector () has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.