The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Mar. 18, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yasuaki Matsushita, Ashigara-kami-gun, JP;

Tokihiko Matsumura, Ashigara-kami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/24 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); H05K 1/092 (2013.01); H05K 3/247 (2013.01); H05K 2201/0769 (2013.01);
Abstract

A wiring board includes: an insulating substrate; and a wiring layer including a first metal layer disposed on the insulating substrate and a second metal layer disposed so as to cover a surface of the first metal layer, the surface not being in contact with the insulating substrate, wherein the thickness of the second metal layer is 1/10 of the total thickness of the wiring layer, the wiring layer contains a migration inhibitor, and the mass Y of the migration inhibitor contained in the second metal layer is greater than the mass X of the migration inhibitor contained in the first metal layer.


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