The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Jun. 10, 2014
Applicant:

Thales, Courbevoie, FR;

Inventors:

Sebastien Bonnet, Courbevoie, FR;

Serge Verdeyme, Limoges, FR;

Michel Campovecchio, Limoges, FR;

Alain Dravet, St Remy l'Honore, FR;

Marc-Yves Lienhart, Paris, FR;

Assignee:

THALES, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/0204 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 3/0011 (2013.01); H05K 3/40 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 1/0237 (2013.01); H05K 3/4623 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10416 (2013.01);
Abstract

The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m·K), placed in the first cavity so as to be in contact with the electronic component.


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