The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Oct. 29, 2015
Applicant:
Triquint Semiconductor, Inc., Hillsboro, OR (US);
Inventors:
Timothy S. Henderson, Portland, OR (US);
Sheila K. Hurtt, Portland, OR (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/45 (2006.01); H01L 29/08 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66318 (2013.01); H01L 21/76879 (2013.01); H01L 29/0817 (2013.01); H01L 29/41708 (2013.01); H01L 29/42304 (2013.01); H01L 29/452 (2013.01); H01L 29/66242 (2013.01); H01L 29/737 (2013.01); H01L 29/7371 (2013.01);
Abstract
Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device includes a diffusion control layer as part of an emitter epitaxial structure. The IC device may utilize a common metallization scheme to simultaneously form an emitter contact and a base contact. Other embodiments may also be described and/or claimed.