The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Feb. 17, 2015
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Tianjia Sun, San Jose, CA (US);

Rui Wang, San Jose, CA (US);

Tiejun Dai, Santa Clara, CA (US);

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); G01S 17/89 (2006.01); G01S 17/02 (2006.01); G01S 7/481 (2006.01); G01S 7/491 (2006.01); H04N 9/04 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14647 (2013.01); G01S 7/4816 (2013.01); G01S 7/4914 (2013.01); G01S 17/023 (2013.01); G01S 17/89 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01); H01L 27/14652 (2013.01); H04N 9/045 (2013.01);
Abstract

A pixel array includes a plurality of visible light pixels arranged in the pixel array. Each one of the plurality of visible light pixels includes a photosensitive element arranged in a first semiconductor die to detect visible light. Each one of the plurality of visible light pixels is coupled to provide color image data to visible light readout circuitry disposed in a second semiconductor die stacked with and coupled to the first semiconductor die in a stacked chip scheme. A plurality of infrared (IR) pixels arranged in the pixel array. Each one of the plurality of IR pixels includes a single photon avalanche photodiode (SPAD) arranged in the first semiconductor die to detect IR light. Each one of the plurality of visible light pixels is coupled to provide IR image data to IR light readout circuitry disposed in the second semiconductor die.


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