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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9607961 B1

PDFFull Text
Date of Patent:
Mar. 28, 2017

Filed:

Mar. 03, 2016

Semiconductor device

Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi Aichi-ken, JP;

Inventor:

Tomohiko Sato, Nissin, JP;

Assignee:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;

Attorney:

Dinsmore & Shohl LLP

Primary Examiner:

David S Blum

Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/739 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/49562 (2013.01); H01L 29/0619 (2013.01); H01L 29/0804 (2013.01); H01L 29/0821 (2013.01); H01L 29/0834 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/7397 (2013.01); H01L 29/402 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate, a front surface electrode provided on a front surface of the semiconductor substrate, a solder layer, and a metal member fixed to a front surface of the front surface electrode via the solder layer. The solder layer includes an inner solder portion positioned inner than an end portion of the metal member and an outer solder portion positioned outer than the end portion of the metal member, relative to a direction along the front surface of the semiconductor substrate. The semiconductor substrate includes an inner substrate portion positioned below the inner solder portion and an outer substrate portion positioned below the outer solder portion. A density of carriers that flow from the outer substrate portion to the front surface electrode is lower than a density of carriers that flow from the inner substrate portion to the front surface electrode.

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