The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Dec. 29, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Yi-Cheng Peng, Taoyuan, TW;

Ming-Hua Yeh, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/481 (2013.01); H01L 23/4985 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact pad is T, and a width of the at least one recess is B, The ACF is disposed on the contact pad and includes a plurality of conductive particles; each of the conductive particles is disposed in the at least one recess. A diameter of the conductive particles is A, and A is larger than B and T and satisfies B≦2(AT−T). The contact structure is disposed on the ACF and electrically connected to the contact pad via the conductive particles. The disclosure also provides a flexible device including a substrate, a patterned insulating layer, at least one contact pad, ACF, and a contact structure.


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