The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Jan. 26, 2016
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Pei-Heng Hung, New Taipei, TW;
Hsiung-Shih Chang, Taichung, TW;
Manoj Kumar, Dhanbad, IN;
Yen-Ni Lee, Jhubei, TW;
Teng-Shao Su, Tainan, TW;
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Abstract
A semiconductor device includes a plurality of first wires and second wires, a first conductive layer, and a second conductive layer. Each of the first wires forms a closed polygon and surrounds a center, and each of the second wires forms the closed polygon and surrounds the center. The first and second wires are interlaced, and none of the first and second wires are coupled to each other. The first conductive layer, having an entire surface structure, is disposed on the first and second wires and coupled to the first wires. The second conductive layer, having an entire surface structure, is disposed on the first and second wires and coupled to the second wires. The first conductive layer is disposed between the second conductive layer and the first and second wires, and the first and second conductive layers are not coupled to each other.