The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Aug. 12, 2015
Applicant:
Abb Technology Oy, Helsinki, FI;
Inventors:
Daniel Kearney, Zürich, CH;
Francesco Agostini, Zofingen, CH;
Didier Cottet, Zürich, CH;
Daniele Torresin, Winterthur, CH;
Mathieu Habert, Baden Daettwill, CH;
Assignee:
ABB Technology OY, , FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/473 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H05K 1/0272 (2013.01); H01L 2924/0002 (2013.01); H05K 1/185 (2013.01); H05K 3/4697 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/064 (2013.01);
Abstract
The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.