The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Apr. 05, 2013
Mektec Manufacturing Corporation (Thailand) Ltd, Ayutthaya, TH;
Chulalongkorn University, Bangkok, TH;
Sathid Jitjongruck, Ayutthaya, TH;
Anongnat Somwangthanaroj, Bangkok, TH;
MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD, Ayutthaya, TH;
CHULALONGKORN UNIVERSITY, Bangkok, TH;
Abstract
The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.