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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9607867 B1

PDFFull Text
Date of Patent:
Mar. 28, 2017

Filed:

Apr. 25, 2016

Substrate processing device and substrate processing method

Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventor:

Yuji Kajihara, Kawasaki, JP;

Assignee:

Canon Anelva Corporation, Kawasaki-shi, JP;

Attorney:

Fitzpatrick, Cella, Harper & Scinto

Primary Examiner:

Mark Paschall

Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 21/67 (2006.01); C23C 14/58 (2006.01); H01L 21/687 (2006.01); H01L 43/12 (2006.01); F25B 9/00 (2006.01); F25B 9/02 (2006.01); F25B 9/14 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); C23C 14/58 (2013.01); F25B 9/002 (2013.01); F25B 9/02 (2013.01); F25B 9/14 (2013.01); H01L 21/67115 (2013.01); H01L 21/68742 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01); H05B 1/0227 (2013.01); H05B 1/0247 (2013.01);
Abstract

The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.

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