The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Jan. 27, 2016
Applicant:

Kyocera Document Solutions Inc., Osaka, JP;

Inventor:

Hitoshi Hayamizu, Osaka, JP;

Assignee:

KYOCERA Document Solutions Inc., Tamatsukuri, Chuo-ku, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); H05B 1/00 (2006.01); H05B 1/02 (2006.01); G03G 21/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/80 (2013.01); G03G 21/203 (2013.01); H05B 1/00 (2013.01); H05B 1/0241 (2013.01); G03G 2215/00666 (2013.01);
Abstract

A heating device includes a plurality of chip resistors, a conductor pattern, and a substrate. The plurality of chip resistors generate heat upon receiving power from a power source. The conductor pattern is arranged so as to serially connect the plurality of chip resistors. The conductor pattern is formed on the substrate. The conductor pattern connecting the chip resistors is wider in a forward path from the power source than in a backward path. The majority of the heat generated by the chip resistor is transmitted from the chip resistor to the conductor pattern, and the transmitted heat is radiated from the conductor pattern. Thus, not only the heat from the surface of the chip resistor but also the heat from the conductor pattern serves as heat source.


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