The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Jul. 08, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Satoshi Ogawara, Koshigaya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); G03G 15/00 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03G 15/80 (2013.01); H05K 3/4015 (2013.01); H05K 1/0254 (2013.01); H05K 1/0269 (2013.01); H05K 3/341 (2013.01); H05K 3/3447 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10257 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10363 (2013.01);
Abstract

A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.


Find Patent Forward Citations

Loading…