The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Dec. 08, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Satoru Nagashima, Kawasaki, JP;

Masayuki Sakai, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); G03G 15/04 (2006.01); G01N 21/47 (2006.01);
U.S. Cl.
CPC ...
G03G 15/5058 (2013.01); G01N 21/474 (2013.01); G03G 15/04036 (2013.01); G03G 15/5054 (2013.01); G01N 2201/0642 (2013.01); G03G 15/5041 (2013.01); G03G 15/5062 (2013.01); G03G 2215/00042 (2013.01); G03G 2215/00616 (2013.01);
Abstract

To prevent the detection accuracy from deteriorating due to stray light, an optical apparatus includes the following configuration. The optical apparatus includes a light-emitting member, a light-receiving member, and a substrate on which the light-emitting member and the light-receiving member are mounted. The substrate includes a plate-like substrate layer and a plate-like conductive layer. The optical apparatus further includes a light-shielding member disposed between the light-receiving member and the light-emitting member and inserted in a through-hole of the substrate provided between the light-receiving member and the light-emitting member. The light-receiving member receives reflected light from a portion to be irradiated with the light emitted from the light-emitting member. The conductive layer is excellent in light-shielding property compared to the substrate layer. The conductive layer is exposed to an inner cylindrical surface of the through-hole.


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