The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Feb. 21, 2012
Applicants:

Kohnosuke Yamamoto, Nagoya, JP;

Seiji Tsuji, Nagoya, JP;

Kazuya Watanabe, Nagoya, JP;

Inventors:

Kohnosuke Yamamoto, Nagoya, JP;

Seiji Tsuji, Nagoya, JP;

Kazuya Watanabe, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/48 (2006.01); B29C 45/00 (2006.01); B29K 105/06 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/48 (2013.01); B29C 45/0005 (2013.01); B29C 45/0046 (2013.01); B29K 2105/06 (2013.01); B29L 2009/00 (2013.01);
Abstract

A method for producing FRP in which a preform made of a reinforcing fiber base material is disposed in a cavity of a mold, a resin injection path and a suction path that sucks at least air are provided to the mold, and resin from the resin injection path is caused to flow in the direction toward the suction path in the cavity to be impregnated into the preform, wherein a high flow resistance region for partially making the resin flowing in the preform hardly flow is formed in the preform itself, and a flow front of the resin flowing in the direction toward the suction path through the high flow resistance region is controlled to settle within a permitted region that has been predetermined relative to a shape of a product to be molded.


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