The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Sep. 23, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Mark S. Chace, Beacon, NY (US);

Qin Yuan, Poughquag, NY (US);

Nitin Jadhav, Wappingers Fall, NY (US);

Janine L. Protzman, Poughkeepsie, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 31/02 (2006.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 1/20 (2006.01); C23C 18/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/20 (2013.01); B23K 35/0222 (2013.01); B23K 35/3612 (2013.01); C23C 18/48 (2013.01); H05K 3/3473 (2013.01); H05K 2203/044 (2013.01);
Abstract

A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: wherein R, R, R, R, R, R, R, R, R, and Rare independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR' wherein R′ is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R, R, R, R, and Ror any two, three, or four of R, R, R, R, and Rare optionally interconnected to form a fused ring system; Rand Rare independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.


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