The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Sep. 13, 2012
Applicants:

Guido Suter, Geuensee, CH;

Ruedi Grueter, Buttisholz, CH;

Inventors:

Guido Suter, Geuensee, CH;

Ruedi Grueter, Buttisholz, CH;

Assignee:

ESEC AG, Cham, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0404 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75822 (2013.01); Y10T 29/53178 (2015.01);
Abstract

An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.


Find Patent Forward Citations

Loading…