The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Dec. 15, 2015
Applicant:

Industrial Technology Research Institute, Hsin-Chu, TW;

Inventors:

Shih-Hsiang Chien, Yilan County, TW;

Chin-Hone Lin, Nantou County, TW;

Ching-Jin Tyan, Hsinchu County, TW;

Bo-Tseng Sung, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 3/00 (2006.01); H05K 5/02 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); H05K 3/0061 (2013.01); H05K 5/0013 (2013.01); H05K 5/0247 (2013.01);
Abstract

An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second metal plates, and an annular frame. The first metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; at least one of the first metal plates may include a plurality of chip slots. The chips may be disposed at the chip slots; each of the chips may be electrically coupled to one of the adjacent first metal plates. The second metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; each of the second metal plates may be disposed between any two adjacent first metal plates. The first metal plates, the second metal plates, the gate driver circuit, and the chips may be disposed inside the annular frame.


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