The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Oct. 09, 2015
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Brandon W. Pillans, Plano, TX (US);

James Mcspadden, Allen, TX (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 7/20 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/202 (2013.01); H05K 13/0023 (2013.01);
Abstract

An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.


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