The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Nov. 15, 2010
Applicants:
Mark Allen, Espoo, FI;
Jaakko Leppäniemi, Espoo, FI;
Tomi Mattila, Espoo, FI;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 3/38 (2006.01); H05K 3/12 (2006.01); C09D 11/52 (2014.01); B82Y 30/00 (2011.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); B82Y 30/00 (2013.01); C09D 11/52 (2013.01); H05K 1/038 (2013.01); H05K 3/12 (2013.01); H05K 3/1283 (2013.01); H05K 3/38 (2013.01); H05K 3/125 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0284 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01);
Abstract
The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.