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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9603246 B1

PDFFull Text
Date of Patent:
Mar. 21, 2017

Filed:

Dec. 05, 2014

Electronic package, package carrier, and method of manufacturing package carrier

Applicant:

Adl Engineering Inc., Hsin-Chu, TW;

Inventors:

En-Min Jow, Hsin-Chu, TW;

Cheng-Yu Kang, Hsin-Chu, TW;

Assignee:

ADL ENGINEERING INC., Hsin-Chu, TW;

Attorney:

Chieh-Mei Wang

Primary Examiner:

Allen Parker

Assistant Examiner:

Gustavo Ramallo

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/4853 (2013.01); H01L 23/145 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 24/97 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating pattern is formed on the conductive layer. The insulating pattern exposes a portion of the conductive layer. A supporting board is provided. Next, the insulating pattern is detachably fixed in the supporting board. After the insulating pattern is detachably fixed in the supporting board, the holding substrate is removed, and the conductive layer remains. After removing the holding substrate, the conductive layer is patterned to form a wiring layer.

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