The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Sep. 10, 2007
Applicants:

Shinji Tsuchikawa, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Masanori Akiyama, Ibaraki, JP;

Inventors:

Shinji Tsuchikawa, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Masanori Akiyama, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); C08G 59/40 (2006.01); H05K 1/03 (2006.01); C08G 59/50 (2006.01); C08G 73/12 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); B32B 15/092 (2006.01); B32B 15/14 (2006.01); C08L 25/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); C08G 59/4042 (2013.01); C08G 59/5086 (2013.01); C08G 73/12 (2013.01); C08G 73/124 (2013.01); C08L 63/00 (2013.01); C08L 79/085 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); C08L 25/08 (2013.01); Y10T 428/31678 (2015.04);
Abstract

The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.


Find Patent Forward Citations

Loading…