The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

May. 29, 2014
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventors:

Ronald Steven Cok, Rochester, NY (US);

Thomas Nathaniel Tombs, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G06F 3/044 (2013.01); H05K 1/0274 (2013.01); H05K 1/189 (2013.01); H05K 3/107 (2013.01); H05K 3/1258 (2013.01); H05K 3/22 (2013.01); H05K 3/4635 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49156 (2015.01); Y10T 29/49158 (2015.01); Y10T 156/1015 (2015.01);
Abstract

A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the flexible substrate. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is located adjacent to the second portion in a perpendicular direction. The flexible substrate is folded with at least a second fold between the second and third portions so that the second side is between the second portion and the third portion in the perpendicular direction. The folded flexible substrate is secured to form the folded micro-wire substrate structure.


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