The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Mar. 24, 2016
Applicant:

Apple Inc., Cuptertino, CA (US);

Inventors:

Charles B. Woodhull, San Francisco, CA (US);

Jason S. Sloey, Cedar Park, TX (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01R 24/58 (2011.01); H01R 13/50 (2006.01); H04M 1/02 (2006.01); H01R 105/00 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/58 (2013.01); H01R 13/50 (2013.01); H04M 1/0274 (2013.01); H05K 5/0004 (2013.01); H01R 2105/00 (2013.01); H01R 2107/00 (2013.01);
Abstract

Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.


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