The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Jun. 19, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yuya Okada, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1052 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield.


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