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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9601455 B1

PDFFull Text
Date of Patent:
Mar. 21, 2017

Filed:

Jun. 30, 2015

Semiconductor device and method for making semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Yuto Nishiyama, Kyoto, JP;

Motoharu Haga, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Benjamin Sandvik

Int. Cl.
CPC ...
G01R 33/02 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); G01R 33/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); G01R 33/0005 (2013.01); G01R 33/0047 (2013.01); G01R 33/02 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 24/45 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/11 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin.

Find Patent Forward Citations

Nishiyama, Yuto. (2017). Semiconductor device and method for making semiconductor device (U.S. Patent No. 9601455). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9601455

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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