The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Aug. 29, 2016
Applicants:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

Inventors:

John A. Starkovich, Redondo Beach, CA (US);

Edward M. Silverman, Encino, CA (US);

Jesse B. Tice, Torrance, CA (US);

Hsiao-Hu Peng, Rancho Palos Verdes, CA (US);

Michael T. Barako, Gettysburg, PA (US);

Kenneth E. Goodson, Portola Valley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 20/02 (2006.01); C25D 3/30 (2006.01); C25D 3/48 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C25D 7/06 (2006.01); C25D 9/02 (2006.01); B82Y 30/00 (2011.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 1/0012 (2013.01); B23K 20/023 (2013.01); B82Y 30/00 (2013.01); C25D 3/30 (2013.01); C25D 3/48 (2013.01); C25D 5/02 (2013.01); C25D 5/48 (2013.01); C25D 7/0607 (2013.01); C25D 9/02 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/27466 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83232 (2013.01); H01L 2224/83238 (2013.01);
Abstract

A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.


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