The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Aug. 11, 2015
Applicant:
Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Joseph Kuczynski, North Port, FL (US);
Melissa K. Miller, Morrisville, NC (US);
Heidi D. Williams, Cary, NC (US);
Jing Zhang, Poughkeepsie, NY (US);
Assignee:
Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); B23K 1/0016 (2013.01); H01L 23/3142 (2013.01); H01L 23/49838 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H05K 3/341 (2013.01); H01L 2224/11011 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/06 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1531 (2013.01);
Abstract
Example methods, apparatus, and products for creating an environmentally protective coating for integrated circuit assemblies are described herein. A preform plastic sheet is places over components of an integrated circuit such that during a reflow process, the preform plastic sheet melts to form a conformal coating over components of the integrated circuit assembly.