The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Apr. 08, 2016
Applicant:
Waseda University, Tokyo, JP;
Inventor:
Kohei Tatsumi, Tokyo, JP;
Assignee:
WASEDA UNIVERSITY, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/10 (2013.01); H01L 21/52 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/76 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/37 (2013.01); H01L 24/45 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05173 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05673 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2499 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24245 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/3716 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40991 (2013.01); H01L 2224/40996 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48839 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/48873 (2013.01); H01L 2224/48991 (2013.01); H01L 2224/48996 (2013.01); H01L 2224/73255 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73273 (2013.01); H01L 2224/73277 (2013.01); H01L 2224/75754 (2013.01); H01L 2224/76754 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81464 (2013.01); H01L 2224/81473 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81901 (2013.01); H01L 2224/82002 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82399 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/8392 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83473 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83901 (2013.01); H01L 2224/8492 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/9201 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/3656 (2013.01);
Abstract
An electrode connection structure includes: a first electrode of an electrical circuit; and a second electrode of the electrical circuit that is electrically connected to the first electrode. The first and second electrodes are oppositely disposed in direct or indirect contact with each other. A plated lamination is substantially uniformly formed by plating process from a surface of a contact region and opposed surfaces of the first and second electrodes. A void near the surface of the contact region is filled by formation of the plated lamination. Portions of the plated lamination formed from the opposed surfaces of the first and second electrodes in a region other than the contact region are not joined together.