The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Mar. 02, 2016
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/3171 (2013.01); H01L 23/3178 (2013.01); H01L 23/3192 (2013.01); H01L 23/528 (2013.01); H01L 23/544 (2013.01); H01L 24/02 (2013.01); H01L 24/10 (2013.01); H01L 24/96 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2223/5446 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/16 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip, a groove formed in a periphery of a surface of the semiconductor chip being tapered toward a rear surface of the semiconductor chip, wherein the sealing resin layer is partly disposed in the groove.