The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Oct. 25, 2012
Applicants:

Shoji Saito, Tokyo, JP;

Khalid Hassan Hussein, Tokyo, JP;

Arata Iizuka, Tokyo, JP;

Inventors:

Shoji Saito, Tokyo, JP;

Khalid Hassan Hussein, Tokyo, JP;

Arata Iizuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 23/36 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 23/552 (2006.01); H01L 23/28 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 23/12 (2013.01); H01L 23/28 (2013.01); H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 23/36 (2013.01); H01L 23/552 (2013.01); H01L 24/33 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor device of the present invention includes a semiconductor element having an upper surface and a lower surface, a metal plate thermally connected to the lower surface, an upper surface electrode soldered to the upper surface, an insulating sheet formed on the upper surface electrode so as to be in surface contact with the upper surface electrode, a shielding plate formed on the insulating sheet so as to be in surface contact with the insulating sheet, the shielding plate shielding against radiation noise, and a resin with which the semiconductor element is covered, while a portion of the upper surface electrode, a portion of the shielding plate and a lower surface of the metal plate are exposed to the outside, wherein the heat conductivity of the insulating sheet is higher than the heat conductivity of the resin.


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