The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Jun. 25, 2014
Applicant:
Quanta Computer Inc., Kuei Shan Hsiang, Tao Yuan Shien, TW;
Inventor:
Li-Cheng Shen, Tao Yuan Shien, TW;
Assignee:
QUANTA COMPUTER INC., Guishan Dist., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/433 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/433 (2013.01); H01L 23/367 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A system-in-package (SiP) module is disclosed. The SiP module includes a substrate and a dam on the substrate. The dam defines a cavity. At least one chip is on the substrate inside the cavity. A printed circuit board (PCB) is bonded to the dam and covers the cavity. A thermal conductive sheet is in the cavity and is disposed between the chip and the PCB. The chip is in thermal contact with the PCB through the thermal conductive sheet. The disclosure also provides a method for manufacturing the SiP module.