The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9601327 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 21, 2017

Filed:

Aug. 17, 2015
Applicant:

Board of Regents University of Oklahoma, Norman, OK (US);

Inventor:

Patrick J. McCann, Norman, OK (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02488 (2013.01); H01L 21/0254 (2013.01); H01L 21/02485 (2013.01); H01L 21/02505 (2013.01); H01L 21/6835 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/3735 (2013.01); H01L 29/2003 (2013.01); H01L 29/778 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32502 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0532 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/06 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1423 (2013.01);
Abstract

A high power electronic device package constructed to include a high power electronic device having an epitaxial surface attached to a thermally conductive submount by a thermally conductive interface layer having a eutectic metal contact therein. A gallium nitride high electron mobility transistor (GaN HEMT) having a transistor structure formed of a GaN thin film layer bonded to a thermally conductive host substrate via a thermally conductive interface layer disposed therebetween, and a method of forming the GaN HEMT. The GaN HEMTs can be used in such applications as, for example, power amplifiers with x-band radio frequency (RF) power outputs for micro-radar applications.


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