The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Feb. 07, 2014
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Bok Rim Ko, Seoul, KR;
Dong Kyun Kim, Cheongju-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/16 (2006.01);
U.S. Cl.
CPC ...
G06F 13/16 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01);
Abstract
Semiconductor chips are provided. The semiconductor chip includes a first data pad, a first data strobe pad and a second data pad sequentially arrayed from a command address pad in a first direction. In addition, the semiconductor chip includes a third data pad, a second data strobe pad and a fourth data pad sequentially arrayed from the command address pad in a second direction. Data are inputted and outputted through the first and fourth data pads or through the second and third data pads in a predetermined bit organization. Related semiconductor chip packages and semiconductor systems are also provided.