The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Mar. 13, 2015
Motoyoshi Yamano, Tokyo, JP;
Kohichi Utsunomiya, Kanagawa, JP;
Hiromasa Takagi, Tokyo, JP;
Kenji Ishii, Kanagawa, JP;
Takayuki Seki, Kanagawa, JP;
Keitaro Shoji, Kanagawa, JP;
Hideo Nagafuji, Kanagawa, JP;
Yuji Arai, Kanagawa, JP;
Arinobu Yoshiura, Kanagawa, JP;
Shohei Saito, Kanagawa, JP;
Qifeng Cui, Tokyo, JP;
Yutaka Ikebuchi, Kanagawa, JP;
Motoyoshi Yamano, Tokyo, JP;
Kohichi Utsunomiya, Kanagawa, JP;
Hiromasa Takagi, Tokyo, JP;
Kenji Ishii, Kanagawa, JP;
Takayuki Seki, Kanagawa, JP;
Keitaro Shoji, Kanagawa, JP;
Hideo Nagafuji, Kanagawa, JP;
Yuji Arai, Kanagawa, JP;
Arinobu Yoshiura, Kanagawa, JP;
Shohei Saito, Kanagawa, JP;
Qifeng Cui, Tokyo, JP;
Yutaka Ikebuchi, Kanagawa, JP;
RICOH COMPANY, LTD., Tokyo, JP;
Abstract
A fixing device includes: a fixing member that is rotatable and in an endless shape; a heat source that heats the fixing member; a nip forming member that is arranged inside the fixing member; and a pressurizing member that is pressurized to be in contact with the nip forming member through the fixing member, to form a fixing nip. The fixing device fixes an unfixed image on a recording medium by passing the recording medium that carries the unfixed image through the fixing nip. The nip forming member includes a base layer, and a high thermal-conductive layer that is arranged on a surface layer of the base layer on a fixing nip side, and that has higher thermal conductivity than the base layer, and in the high thermal-conductive layer, a low thermal-conductive portion is arranged near an end portion in an axial direction of the fixing member.