The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Mar. 22, 2016
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Atsushi Uematsu, Fuji, JP;

Tomohito Taniguchi, Suntou-gun, JP;

Masahiro Watanabe, Mishima, JP;

Noboru Miyagawa, Suntou-gun, JP;

Taichi Sato, Numazu, JP;

Takehiko Aoyama, Suntou-gun, JP;

Takeshi Yoshidome, Kitakyushu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); G03G 5/043 (2006.01); G03G 5/05 (2006.01);
U.S. Cl.
CPC ...
G03G 5/043 (2013.01); G03G 5/0525 (2013.01);
Abstract

The electrophotographic member includes an electro-conductive substrate and an electro-conductive resin layer as the surface layer on the substrate. The electro-conductive resin layer contains a binder and a bowl-shaped resin particle; the surface of electrophotographic member has a concavity derived from the opening of the bowl-shaped resin particle, a protrusion derived from the edge portion of the opening and the electro-conductive resin layer; and when the surface of the member is observed using a scanning electron microscope at an accelerating voltage (1 kV) and a magnification (×2000) while applying a DC voltage (50 to 100 V) between an electrode disposed opposite to the electrophotographic member and the substrate, the brightness of the protrusion, K, the brightness of the bottom of the concavity, K, and the brightness of the exposed surface of the electro-conductive resin layer, K, satisfy K<K, K<Kand 0.8≦K/K≦1.2.


Find Patent Forward Citations

Loading…