The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Mar. 12, 2014
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Sang-Wook Shin, Yongin, KR;

Sun-Young Jung, Yongin, KR;

Il-Sang Lee, Yongin, KR;

Jin-Woo Park, Yongin, KR;

Dong-Jin Kim, Yongin, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/457 (2006.01); C23C 14/34 (2006.01); C23C 14/08 (2006.01); H01J 37/34 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); C23C 14/086 (2013.01); H01J 37/3414 (2013.01); H01J 37/3426 (2013.01); H01J 37/3429 (2013.01); H01L 51/5253 (2013.01);
Abstract

A method of fabricating a sputtering target includes preparing a first powder material including at least one of a tin oxide and a mesh-forming oxide; mixing the first powder material and a second powder material comprising carbon or a tin oxide to prepare a mixture; simultaneously performing a primary compression and primary sintering on the mixture in a reduction atmosphere; and simultaneously performing a secondary compression and secondary sintering on the mixture in the reduction atmosphere to prepare the sputtering target.


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