The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Oct. 27, 2011
Applicants:

Andri E. Elia, Chadds Ford, PA (US);

Olaf Norbert Kirchner, Genolier, CH;

Martyn Douglas Wakeman, Gland, CH;

Shengmei Yuan, Newark, DE (US);

Inventors:

Andri E. Elia, Chadds Ford, PA (US);

Olaf Norbert Kirchner, Genolier, CH;

Martyn Douglas Wakeman, Gland, CH;

Shengmei Yuan, Newark, DE (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/12 (2006.01); B32B 27/34 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); C08J 5/04 (2006.01); C08L 77/06 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29K 77/00 (2006.01); B29K 677/00 (2006.01); B29K 709/08 (2006.01);
U.S. Cl.
CPC ...
B32B 27/34 (2013.01); B29C 45/0001 (2013.01); B29C 45/14786 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); C08J 5/043 (2013.01); C08L 77/06 (2013.01); B29K 2077/00 (2013.01); B29K 2677/00 (2013.01); B29K 2709/08 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/10 (2013.01); B32B 2264/12 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01); B32B 2307/546 (2013.01); B32B 2605/00 (2013.01); C08J 2377/06 (2013.01); C08L 2205/02 (2013.01); Y10T 428/24994 (2015.04); Y10T 428/249921 (2015.04); Y10T 428/249924 (2015.04); Y10T 428/31623 (2015.04); Y10T 428/31725 (2015.04); Y10T 428/31728 (2015.04); Y10T 442/20 (2015.04); Y10T 442/2041 (2015.04); Y10T 442/2631 (2015.04); Y10T 442/2721 (2015.04); Y10T 442/2762 (2015.04); Y10T 442/2861 (2015.04); Y10T 442/2984 (2015.04); Y10T 442/2992 (2015.04); Y10T 442/674 (2015.04);
Abstract

Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.


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