The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Sep. 22, 2011
Applicants:
Satoru Asagiri, Yokohama, JP;
Kyoko Kato, Yokohama, JP;
Yasuyuki Ito, Saku, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); B29C 70/70 (2006.01); B29C 39/10 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 39/10 (2013.01); B29C 70/70 (2013.01); B29C 2043/181 (2013.01); H01L 23/295 (2013.01); H01L 2924/0002 (2013.01);
Abstract
In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.