The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Mar. 03, 2016
Applicant:
Olympus Corporation, Tokyo, JP;
Inventors:
Satoshi Yoshida, Koshigaya, JP;
Takuya Imahashi, Kawasaki, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); H01R 43/28 (2006.01); H01L 23/538 (2006.01); H01R 43/00 (2006.01); A61B 8/12 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0685 (2013.01); A61B 8/12 (2013.01); B06B 1/0607 (2013.01); B06B 1/0622 (2013.01); B06B 1/0633 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01R 43/007 (2013.01); H01R 43/28 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/49147 (2015.01); Y10T 29/49194 (2015.01);
Abstract
A method for manufacturing an ultrasound transducer includes a first step of manufacturing a wiring layer by arranging insulating fibers on conductive threads, a second step of electrically connecting one end of the plurality of conductive threads to a transducer array unit, a third step of providing a first backing material after providing a second backing material so that at least connection sites between the transducer array unit and the conductive threads are embedded, and a fourth step of curing the first backing material so as to fix the transducer array unit and the wiring layer.