The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Oct. 19, 2015
Applicant:

Sdcmaterials, Inc., Tempe, AZ (US);

Inventors:

Maximilian A. Biberger, Scottsdale, AZ (US);

Stephen Edward Lehman, Jr., Spartanburg, SC (US);

Robert Matthew Kevwitch, Tempe, AZ (US);

Qinghua Yin, Tempe, AZ (US);

Jesudos J. Kingsley, Everett, WA (US);

Assignee:

SDCmaterials, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 23/46 (2006.01); B01J 37/08 (2006.01); B01J 37/04 (2006.01); B01J 21/08 (2006.01); B01J 21/04 (2006.01); B01J 23/10 (2006.01); B01J 21/06 (2006.01); B01J 23/02 (2006.01); B01J 31/02 (2006.01); B01J 8/00 (2006.01); B01J 23/83 (2006.01); B01J 27/02 (2006.01); B01J 27/14 (2006.01); B01J 27/20 (2006.01); B01J 27/24 (2006.01); B01J 37/34 (2006.01); B01J 23/40 (2006.01); B01J 23/58 (2006.01); B01J 23/63 (2006.01); B01J 35/00 (2006.01); B01J 23/42 (2006.01); C07C 5/10 (2006.01); B01J 23/00 (2006.01); B01J 35/02 (2006.01); B01J 23/44 (2006.01); B82Y 40/00 (2011.01); B01J 37/02 (2006.01);
U.S. Cl.
CPC ...
B01J 23/464 (2013.01); B01J 8/00 (2013.01); B01J 21/04 (2013.01); B01J 21/063 (2013.01); B01J 21/066 (2013.01); B01J 21/08 (2013.01); B01J 23/00 (2013.01); B01J 23/02 (2013.01); B01J 23/10 (2013.01); B01J 23/40 (2013.01); B01J 23/42 (2013.01); B01J 23/44 (2013.01); B01J 23/58 (2013.01); B01J 23/63 (2013.01); B01J 23/83 (2013.01); B01J 27/02 (2013.01); B01J 27/14 (2013.01); B01J 27/20 (2013.01); B01J 27/24 (2013.01); B01J 31/02 (2013.01); B01J 35/006 (2013.01); B01J 35/0006 (2013.01); B01J 35/0013 (2013.01); B01J 35/0066 (2013.01); B01J 35/023 (2013.01); B01J 37/0211 (2013.01); B01J 37/04 (2013.01); B01J 37/08 (2013.01); B01J 37/349 (2013.01); C07C 5/10 (2013.01); B01J 37/0203 (2013.01); B01J 37/0219 (2013.01); B82Y 40/00 (2013.01); C07C 2101/14 (2013.01); C07C 2521/04 (2013.01); C07C 2523/42 (2013.01); Y02P 20/52 (2015.11); Y10S 977/892 (2013.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01);
Abstract

A metal compound catalyst is formed by vaporizing a quantity of catalyst material and a quantity of carrier thereby forming a vapor cloud, exposing the vapor cloud to a co-reactant and quenching the vapor cloud. The nanoparticles are impregnated onto supports. The supports are able to be used in existing heterogeneous catalysis systems. A system for forming metal compound catalysts comprises means for vaporizing a quantity of catalyst material and a quantity of carrier, quenching the resulting vapor cloud, forming precipitate nanoparticles comprising a portion of catalyst material and a portion of carrier, and subjecting the nanoparticles to a co-reactant. The system further comprises means for impregnating the of supports with the nanoparticles.


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